The engineer selected for the position will have the opportunity to apply their experience in a way that will

have a direct impact on the success of Finwave. The responsibilities will be broad-reaching and will

include work that is both hands-on and more strategic by establishing standard methodologies for

product engineering. The individual will be expected to work cross-functionally to deliver cutting edge

GaN products to our customers.

· Define and develop test plans for production test of Finwave RFIC products, including wafer

probe and final test

· Define load board, socket and probe card designs for best layout practices and signal integrity.

· Manage OSATS through development and qualification of new production test solutions.

· Actively identify test related issues, optimization, and readiness throughout the product life cycle.

· Own test optimization, standardization, and improvement of test methodologies

· Automate test solutions used in lab for engineering activities.

· Apply technical background to support others with their test needs.

· Design PCB’s used for test purposes.

· Perform hands-on lab work to evaluate & characterize new products, including wafer probe and

PCB level characterization.

· Provide technical support relating to product characterization and reliability testing.

· Must be self-motivated and driven to work freely with minimal direction.

· BSEE or similar

· 6+ years of progressive experience working for a RF semiconductor company in Test

Engineering or similar role.

· Successful track-record of releasing RFIC products to volume production and maintaining

products throughout the product life cycle.

· Hands-on experience working with production test performed at OAST’s using automated test

equipment.

· Demonstrated experience working with test and measurement of RF components such as RF

power amplifiers, switches, attenuators, LNA’s, mixers.

· Experience writing code to automate test solutions.

· Experience with characterizing RF IC’s

· Experience analyzing large datasets to understand product performance in order to identify &

mitigate potential issues when released to production.

· Must have experience working with 3 rd party subcons and OSATS to complete technical work

such as IC packaging, reliability testing, or production test development.

· Experience with fundamentals of semiconductor technologies such as SOI, GaAs, GaN

· Authorized to work in the United States.

· Experience working with RF IC’s in a startup environment

· Experience with the some of the following: JMP, Python, ADS, PCB CAD tools

· Experience with failure analysis

$150,000 - $200,000 a year