Process Engineer (Packaging & Assembly)
Technology Organization – Fabrication
As Process Engineer (Packaging & Assembly), you will be in charge of sustaining activities in backend packaging and assembly process toward building quantum integrated circuits. You will spend your time immersed in the hands-on fabrication of these devices. You will work in a fast-paced environment with a wide range of engineers and scientists in process, integration, design and quantum engineering.
- Take immediate ownership of assembly and packaging processes including, but not limited to, die attach, wire bonding, flip chip attach, underfill, solder ball attach, wafer singulation, wafer bonding, etc.
- Create specification, packaging diagram and written work instructions. Utilize die map, die inspection report and e-test results for product pick & place for assembly.
- Establish process metrologies, key metrics, and parameters. Document and maintain monitors and statistical controls to run a predictable and capable process.
- Define and specify requirements for assembly tooling, fixtures and equipment to support manufacturing operations and damage free die handling.
- Guide technicians and operators in process and equipment troubleshooting.
- Support yield and efficiency improvement on die attach, wire bonding, or any other assembly process assigned by management.
- Support assembly and packaging development activities working through the evolution details of next generation process/architecture/product/approach, collaborating with other frontend and backend modules.
- Key member of the team to help establish Rigetti Fab as a leading quantum integrated circuit foundry.
- Position may require the ability to obtain a DoD Secret clearance
- Develop and sustain processes and deliver products that may involve both internal and external houses and service providers.
- Maintain and monitor failure pareto from daily production activities and recommend product and process improvements to enhance yield and efficiency.
- Organize failure data, draw correlations from process interactions and present results in a concise fashion.
- Work with other fab team members, be responsible for tools, material, metrology, and process aspects of backend modules.
- Prepare process requirement documents in defining and acquiring new equipment. Install and qualify new equipment and establish process.
- Should have good planning with excellent written and verbal communication skills.
- Disciplined hands-on approach to development work and technical problem solving.
- MS and/or Ph.D. in Science or Engineering field.
- At least 7+ years of hands-on experience in wide range of semiconductor/MEMS assembly and packaging tools, such as wire bonders, die attach, epoxy dispense, flip-chip assembly, SMT, flux/solder (paste and solder balls), underfilling and cure, and relevant metrology tools. Hands-on experience in die-prep tools, such as wafer mount, wafer singulation, and die eject and handling. Familiar with temporary and permanent wafer bonding.
- Good understanding of cross-functional packaging areas is definite plus. Familiarity in reviewing Si floor plan, package layout and architecture, thermal, mechanical, material, component & system level reliability, testing and failure analysis preferred.
- Strong oral communication skills. Ability to work in cross-functional dynamic team.
- Demonstrated ability to creatively and successfully manage competing priorities; must be able to identify opportunities to drive multiple efforts simultaneously.
- Strong background in SPC and DOE methodologies, and data analysis.
- Comfortable working in cleanroom fab adhering to HAZMAT and ESD practices.
- High degree of comfort with flexible, agile small company environment. Flexibility in work hours and work days.
- Comfortable with MS Office products, JMP, Solid Works, Google-docs
We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.
Rigetti Computing offers a comprehensive benefits package, including healthcare coverage. For more information, refer to our Careers page.
Rigetti Computing is on a mission to build the world’s most powerful computers. Based in Berkeley and Fremont, CA, we are scientists, engineers, builders, and visionaries who believe quantum computing is going to significantly affect health care, how we treat disease, how we generate energy, and how we feed humanity. We design and fabricate quantum circuits and deploy them as quantum computers available online. Our engineers build the full stack of technologies that are integrated into these machines, including cryogenic hardware and microwave circuitry, advanced analog and digital control modules, and a software stack that provides the world’s most advanced SDK and runtime environment for quantum computers. Our quantum computer is available through Our product, Quantum Cloud Services, which is the world’s first full-stack programming and execution environment for quantum/classical computing. We were founded by Chad Rigetti in 2013, and today employ over 120 people.
For more information, refer to our About page.