Silicon Packaging Substrate Design Engineer

Santa Clara or Remote (Taiwan)
Engineering – Platform Engineering (HW) /
Full-time /
The individual in this role is responsible for silicon packaging substrate pathfinding, competitive analysis, mockup design, ball map assignment, package outline drawing (POD), signal and power routing and optimization to meet SIPI, thermal and mechanical requirements, design release, and post-assembly analysis. 


    • As a Packaging substrate designer, you will own or participate in the following: 
    • Work with cross-functional teams to select the optimized package solution
    • Work with IC design, system design, SIPI, thermal, and mechanical engineering teams to design custom substrates and interposers.
    • Work with SoC design teams to optimize die floorplan, bump patterns, and interposer/substrate stackup.
    • Own substrate design deliverables at critical design checkpoints and release substrate to vendors for manufacturing.
    • Responsible for POD and related technical documentation for the package.
    • Work with overseas assembly partners for product bring-up, qualification, and ramp to HVM.


    • Experience in substrate layouts and design in advanced package technologies.
    • Experience or knowledge of2.5D, and 3D package substrate and interposer design.
    • Experience with design teams on floor plan, bump, and layout optimization.
    • Strong authority on Cadence Allegro Package Designer (APD). 
    • Excellent problem-solving, written and verbal communication skills, and organization skills. Self-motivated.
    • Ability to work well in a team and be productive under aggressive schedules.

Education and Experience

    • PhD, Master's, or BS Degree with 7+ years of experience in the subject area.