Silicon Packaging Designer (Interposer, Substrate) - Full Time

(US) Mountain View CA , Austin TX, Portland OR, Fort Collins CO /
Engineering – Platform Engineering (HW) /
The individual in this role is responsible for designing interposer, substrate  or capacitor technology designs and tapeout.


    • Work with cross-functional teams to select the optimized package solution
    • Work with IC design, system design, package SI/PI & thermal engineering teams to design custom interposer and substrates.
    • Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stackup.
    • Own package design deliverables at critical design checkpoints and tape out of package to vendors.


    • Experience on interposer and substrate layouts and design in advanced package technologies.
    • Experience with 2.5D, 3D package design.
    • Experience with design teams on floor plan, bump and layout optimization.
    • Strong authority on Cadence Allegro Package Designer (APD)Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated.
    • Ability to work well in a team and be productive under aggressive schedules.

Education and Experience

    • Master’s Degree  with 10+ years of experience in technical subject area