Mechanical Engineer

(US&Taiwan) Mountain View CA , Austin TX, Portland OR, or Fort Collins CO, HsinChu Taiwan /
Engineering – Platform Engineering (HW) /
/ On-site
We are looking for a highly motivated Mechanical Engineer that will mainly be responsible for performing mechanical design on electronic components at various scales of Rivos hardware equipment. This position will report to the Thermal/Mechanical Engineering Manager and will be in Mountain View, CA or Taiwan.


    • Mechanical design at the component, board and chassis levels.
    • Mechanical design of air/liquid cooled heat sinks&exchangers/cold plates.
    • Assembly design including high power ASIC’s, sockets, heat sinks.
    • Closely working with board designers to determine dimensions, keep out zones, translate ECAD into MCAD and prepare board layouts.
    • Collaborating with the other engineering teams (Reliability, SI/PI, Power, General HW) and making necessary changes on mechanical design.
    • Following the OCP guidelines, understanding the revisions/updates, attending appropriate OCP meetings and applying them to the mechanical design of Rivos chassis.
    • Design of cables and bundling through Rivos chassis at various form factors.
    • Running FEA analysis at board and chassis levels to ensure mechanical Integrity.
    • Generating and maintaining BOM.
    • Working with CM, OEM and ODM’s to develop mockups, test samples and high volume products.


    • Excellent skills in problem solving, written and verbal communication, organization skills, be productive under aggressive schedules and highly self-motivated.
    • Team player with good communication and interpersonal skills.
    • Passionate about working in a startup environment, exploring, learning new techniques and applying them to product design.   
    • Expert MCAD user (Solidworks preferred).
    • Experience with server, chassis (1U/2U fixed boxes preferred) and board/PCB/PWB mechanical design.
    • Experience with tolerance analysis and ASME Y14.5 GD&T guidelines.
    • Experience with Finite Element Analysis (Ansys Mechanical and related Ansys suite of tools preferred).
    • Ability of working on mock up design and preparing test setups and procedures for mechanical and thermal testing (stress/strain, pressure and temperature measurements, metrology).  
    • Ability to use and interpret data from DAQ systems, perform analyses and data reduction and communicate/present to the Platform HW team.
    • Familiarity with cabling/bundling in electronic enclosures.
    • Experience with working with CM, OEM and ODM’s.
    • Familiarity with various fabrication processes including sheet metal, injection molding, soft and hard tooling.
    • Good knowledge/use of MS or Google Office Suite.
    • Good troubleshooting skills with mechanical/thermal design and testing.

Optional Skills

    • Familiarity with Thermal Design Software, i.e. Ansys IcePak, is a big plus.
    • Familiarity with socket design/assemblies is a big plus.
    • Familiarity with OCP mechanical design guidelines and design of Colo boxes.
    • Familiarity with airflow and/or wind tunnel measurements.  
    • Familiarity with LabView (and/or scripting a big plus).
    • Familiarity with network equipment, config and setup.

Education and Experience

    • Minimum education: B.S. degree in Mechanical/Thermal Engineering, Applied Mechanics or Science (Physics). M.S. or Ph.D. preferred.
    • Min. 3-5 years of experience in a product development and/or qualification environment, preferably in the electronics/semiconductor industry.