Physical Design and Integration Engineer

(US,India, UK &Taiwan) Santa Clara CA , Austin TX, Portland OR, or Fort Collins CO, Bangalore India, HsinChu Taiwan, Cambridge UK
Engineering – Silicon Engineering /
Full-time /
Hybrid
Positions are open for full-time in the ares of physical design and integration from sub-system level to full chip level, involving all aspects of physical design partition and integration functions.

Responsibilities

    • Own sub-system level or full chip level physical design integration, particularly focusing on design partition/integration, pin arrangement, feedthrough creation, clock/power grid planning.
    • Be responsible for design integration and signoff coordination at sub-system or full chip level
    • Evaluate/implementation physical design for channel, particularly for route ability and repeater planning
    • Work with block or sub-system owners across the whole design cycles to drive design closure and design release/integration
    • Participate flow/methodology development with CAD team

Requirements

    • Experience in design partitioning, budgeting, pin planning with multiple takeout experience
    • Knowledge using synthesis, place & route, analysis and verification CAD tools.
    • Familiarity with logic & physical design principles to drive low-power & higher-performance designs.
    • Knowledge of scripting in some of these languages: Unix, Perl, Python, and TCL
    • Good understanding of device physics and experience in deep sub-micron technologiesKnowledge of Verilog and SystemVerilog
    • Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated.
    • Ability to work well in a team and be productive under aggressive schedules.
Education and Experience
PhD, Master’s Degree or Bachelor’s Degree in technical subject area with more than five years of experience in relevant areas.