• Design BGA packages for high frequency integrated circuits using Allegro Package Designer using SIP Layout

• Model BGA packaging in 3D and perform tradeoff studies

• Develop package designs for signals exceeding 50 GHz using RF transmission lines

• Work with HFSS and package layout engineers to fine tune package layouts

• Perform other work related duties as assigned

• Ability to exercise judgment within generally defined practices and policies in selecting methods and techniques for obtaining solutions

• Ability to work on problems of diverse scope where analysis of data requires evaluation of identifiable factors

• Must be able to communicate to all levels of the organization as well as outside the organization 

• Ability to manage multiple priorities effectively

• Strong sense of urgency and strong sense of ownership

• Proactive approach, positive attitude and disposition

• Self Managed, Disciplined, Decisive, Organized, Driven Performer, Complex Solving Skills

• A minimum of 4 years of experience with integrated circuit package designs

• Familiarity with transmission line routing for frequencies above 1 GHz

• Very proficient with Cadence Allegro Package Designer using SIP Layout

• Expertise optimizing high density package designs based upon a solid understanding of signal types and routing priorities

• Some experience with Allegro PCB Designer or Ansys Q3D is a plus

• Problem solving and planning skills

• US citizenship required